BGA Syringe Tin Solder Paste Leaded has the following product features:
- Weight: 20 g
- Model: WNB 183℃ Soldering Flux Solder Tin Paste
- Material: Solder paste material
- Wettability: Excellent wetting, high reliability
- Function: Can effectively prevent the collapse of the printing and preheat
- Feature: Tack lasting, easy to dry, sticky time for more than 48 hours
- Environmental Performance: A colorless transparent, does not affect the test, fine-clean and cleaning performance
- Stored: Products wetting, anti-dry and strong, long shelf life at room temperature
- Application: PCB board repair essential materials
- Package includes: 1 x BGA Syringe Tin Solder Paste














Jerry R. –
Having struggled with soldering SMT components for decades, I came across this new Tin/Bismuth/Silver solder on Amazon. Well, it was new to me, as I have used tin/lead solder for decades. I bought a tube, turned my hot-air gun down to 310 (from 350) and can solder the tiny stuff like never before. The difference is night and day. If you are still using tin/lead on hand-assembled SMD/SMT prototypes then you really owe it to yourself to spend a few dollars trying this new low-temperature alloy. I threw all my tin-lead syringes away. Having to solder with hot-air at 340-360 is no fun at all, this stuff really brought back the smile to my face.